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Figure 6 from Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe

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Michael MAYER, Associate Professor, Ph.D., University of Waterloo, Waterloo, UWaterloo, Department of Mechanical and Mechatronics Engineering

Figure 4 from Failure Mechanism and Solution Study of IC Wire Bond

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PDF) The Effects of Wire Bond Parameters on Fine-Pitch Reliability

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