Kyung-Wook PAIK Korea Advanced Institute of Science and
Micromachines, Free Full-Text
UBM (under bump metallurgy) structure
Sputtered UBM and Printed Solder Paste Bumping [18]
Interconnection in IC Assembly - ppt video online download
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect
U-Bump Metalization - Tango
Electroless UBM Formation Service|Special Site of JX Metals
UBM (Under Bump Metallization)
Pb-Free Solders for Flip-Chip Interconnections
Materials, Free Full-Text
Scaling Bump Pitches In Advanced Packaging