Solder Bump Bonding, Ball Bumps and Wire Bonds

Solder Bump Bonding, Ball Bumping and Wire Bonding are first level interconnection methods used in microelectronic packaging

PTI Blog wire bonding materials (2)

Chip Bonding - an overview

Scaling Bump Pitches In Advanced Packaging

JCET Group - Wafer Bumping

Gold Stud Bumps in Flip-chip Applications

NEWS - Strong Electronics&Technology Limited

Fujitsu Achieves Breakthrough in Ultrafine-Pitch Solder Bumping

Wire Bonding: Efficient Interconnection Technique

How to: Cold Bump Pull test? Use the free CBP guide!

NEWS - Strong Electronics&Technology Limited

Solder ball - Wikipedia

PTI Blog wire bonder (2)

PTI Blog wire bonder (2)

Bumping Services

Position determination of a gamma ray point source using a single layer Compton camera