Wafer level packaging and flip chip design are the most recent trends in LED manufacturing and packaging. These LED types are perfectly suited for producing COB modules. This combination already promises better thermal performance than standard SMD package based products. However, there is still room for improvements. Pao Chen, Director of Research and Development at Flip Chip Opto shows how a 3-pad flip chip LED further reduces thermal resistance, allows higher power and can help to reduce costs.
mondo*arc Apr/May 2017 - Issue 97 by Mondiale Media - Issuu
Why is Flip Chip COB LED the Future of Displays?_SHENZHEN LP DISPLAY TECHNOLOGY Co.,Ltd
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High-powered 3W LED COB light chip emits impressively bright light Has an operating voltage of 9 - 12 V The chip measures just 20mm in diameter
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